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Semiconductor Industry

2024-07-30

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JSM-PI polyimide is a high-performance special engineering plastic developed and produced by Huangshan Jinshimu Plastic Technology Co., Ltd. It has excellent high-temperature stability, mechanical properties, electrical insulation, chemical stability, low thermal expansion coefficient, dimensional stability, low outgassing and processing performance, making it a key material in the semiconductor manufacturing process and widely used in wafer manufacturing, packaging testing and other links.

  • High-temperature stability
    Application: used for wafer carriers and fixtures in high-temperature environments.
    Advantages: It can remain stable above 300°C, suitable for high-temperature processes in semiconductor manufacturing.
  • Excellent mechanical properties
    Application: used to manufacture automation equipment components such as robotic arms and conveyor belts.
    Advantages: High strength and high rigidity to ensure the reliability of equipment in high-speed operation.
  • Good electrical insulation
    Application: used for insulating parts, transfer materials, etc.
    Advantages: High resistivity and low dielectric constant to reduce defective rate.
  • Chemical stability
    Application: used for chemical mechanical polishing (CMP) pads, cleaning equipment components, etc.
    Advantages: Resistant to organic solvents, suitable for harsh chemical environments.
  • Low thermal expansion coefficient
    Application: Used for masks, substrates, etc. in photolithography machines.
    Advantages: The thermal expansion coefficient is close to that of silicon, reducing thermal stress and improving device reliability.
  • Excellent dimensional stability
    Application: Used for precision molds, positioning devices, etc.
    Advantages: Maintain dimensional stability under temperature and humidity changes to ensure manufacturing accuracy.
  • Low outgassing
    Application: Used for parts in vacuum environments, such as vacuum chamber liners, etc.
    Advantages: Low outgassing under vacuum and high temperature to avoid contamination.
  • Good processing performance
    Application: Used for parts with complex shapes, such as connectors, seals, etc.
    Advantages: Continuously maintain dimensional stability in harsh environments.